THE PROCESS
Pulses of high intensity light are used in place of a reflow oven to heat the solder to its liquidus temperature in milliseconds without damaging the underlying substrate.
Safer
High energy doses can be applied without damaging conductive tracks by protecting them with light-reflecting layers.
flexible soldering
Multiple types of components requiring different levels of heat can be soldered simultaneously.
lead free
Enables the use of standard lead-free solder pastes on temperature sensitive substrates – not possible with any other processing method.