Equipment for automated inspection or aid in inspection
GENESYS-PIN
- Specialized AOI for the inspection of PIN in automotive electronics and communication products.
UNICOMP CX3000 Benchtop X-ray
- Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc.
3D SPI Solder Paste Inspection
- Solder paste thickness inspection BT-460 is mainly used to measure the thickness of solder layer on PCB. Its principle is that a very thin laser beam is emitted by the laser to illuminate the PCB at a certain Angle, and then the camera is used to observe the laser beam forming a thin line on PCB. Solder paste height and…
