Equipment for automated inspection or aid in inspection
UNICOMP CX3000 Benchtop X-ray
- Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc.
3D SPI Solder Paste Inspection
- Solder paste thickness inspection BT-460 is mainly used to measure the thickness of solder layer on PCB. Its principle is that a very thin laser beam is emitted by the laser to illuminate the PCB at a certain Angle, and then the camera is used to observe the laser beam forming a thin line on PCB. Solder paste height and…
Stencil Inspection Machine System SIM-230
- Stencil information management system supports stencil acceptance, requisition, return, cleaning, inspection, repair and scrap process control, and all related data information can be inputted automatically without any paper work. The data can be kept forever and checked easily at any time, all the paper management and manual input work can be omitted, which can not only improve the work efficiency…
UNICOMP AX8200
- 100kV 5μm X-ray Generator Image enhancer & 2 million digital camera Multi-function carrier platform & X, Y direction± 60° rotation. Convenient target point positioning system BGA Void ratio automatic calculation Max. detection area 385mm*435mm
UNICOMP AX8500 X-Ray
- Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features • 110kV 5µm closed X-ray tube, high speed & Millions pixels high resolution FPD • Tilt detection with ±45° operation together with 6-axis movement • X-ray tube & detector automatic lifting and descending,…
