DA-350LFC Series Lead Free Air Wave Soldering System
- Features Special strengthening wetting nozzle design ensures the best solder joint quality and prevents the solder dross from staining PCB. Special ultra-low oxygenation nozzle design. Solder dross is less than 1 kg every 8 hours (the test base on Senju SAC305 solder bar) Solder pot made of Titanium alloy or 316L ensure long life time and stability. Two stage cooling…
DA-350LFC-N Series Lead Free Nitrogen Wave Soldering System
- Features Closed nitrogen environment effectively prevents PCB solder pad and component from oxygenation under high temperature environment, and improves the wettability and liquidity, make the solder joint satiation and brightness. Used nitrogen cooling, the cooling rate is up to 3~8 ℃/s. Advanced nitrogen channel design ensures super excellent stability and ultra-low nitrogen consumption and ultra-low using cost. The nitrogen consumption…
Lead Free Wave Solder
- High quality build. Good heat uniformity of the solder pot. Designed to reduce solder residue. Patented design of the impeller & channel for improved solder wave stability. Even spray and minimal overlapping. Easy maintenance.
