Bentec Dip Solder Machine & Dip Solder Pots
Description
Features
Pin-type, “bed-of-nails” PCB holder for boards from 60 x 60 mm (2.4″ x 2.4″) to 350 x 300 mm (13.8″ x 11.8″); no special fixturing or pallets needed.
Multiple small boards can be processed simultaneously, provided they fit within the 350 x 300mm area; pin supports allow random placement of PCBs and assemblies in loading area.
Independent, dial-adjustable, speed controls for left and right elevator motors control dipping angle and speed to simulate wave soldering.
Digital timer for setting solder dwell time; typically 3-5 seconds.
Stainless steel solder pot; holds approx. 70 Kg (154 lbs.) lead-free SAC; approx. 85 Kg (187 lbs.) SnPb, Titanium solder pot is optional.
Digital PID solder pot temperature controller for lead-free SAC or SnPb solders.
Automatic dross skimmer and collection trough; cycles prior to dip soldering function.
Multi-day, 24-hr. timer for automatic startup; allows melting of solder and heating to desired solder bath temperature prior to production.
Foot pedal for hands-free actuation of soldering cycle.
Dia-adjustable preheat timer to simulate wave soldering.
Optional spray fluxer accessory available.
