Epius Master-1000 BGA Rework Station.




  • Touch screen with human interface, heating time, heating temperature, reflow temperature rate, advanced alarming, vacuum time all can be set inside the touch screen, simple operation, easy to learn.
  • PLC from Japan, temperature control module use Chinese top brand, display three temperature curves, 4pcs independent temperature sensors, which can measure the different position temperature of the chips, ensuring the rework rate.
  • Three independent heating temperature zone, each heating temperature zone can independently set the heating temperature, heating time, rate; six heating temperature sections, Simulates the reflow oven heating mode [preheating, constant, warming, soldering, reflow soldering, cooling]
  • Auto feed chips, pick up chips, blowing chips; auto recognition chips place during alignment Multifunction mode. weld, remove, mount, manual], realize semi auto and auto function, to meet the customer’s requirement
  • High precision K-type Closed Loop from USA together with our company special heating technology, the soldering range of temperature within ±1℃
  • Imported optical alignment system with 15’’high definition monitor; high precision micrometer adjusts X/Y/R axis; ensuring the alignment precision within 0.01-0.02mm.
  • Top heater and mounting heater design 2 in 1 which makes the mounting more accurate; there are many sizes of BGA nozzles which can meet different chips sizes, BGA nozzles can be easily changed, we can also customize.
  • High automatic and precision, completely eliminates human operation error; it is good for reworking lead-free craft and double BGA, QFN, QFP, capacitance-type resistor components which can achieve good result.
  • Additional monitoring camera which can observe the solder ball melting and easily check the temperature curve and the soldering result (optional function)