Mirtec MS-11e SPI System

Categories: , Tags: , , ,


MS-11e Series Outstanding performance at reasonable price

Outstanding performance

– Super high resolution CXP camera and precision 6㎛ lens
– Solder paste inspection up to 0201(㎜) size component pad
– High accuracy & repeatability
– Shadow-free dual projection 3D measurement
– Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel

Auto PCB warpage compensation

Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine

Intellisys® : Total process management system for improving productivity and achieving smart factory

Standard 3D AOI for various manufacturing process

Documents Download

MIRTEC Foreign Object Detection


Additional information

Inspection Type