Mirtec MS-11e SPI System
Description
MS-11e Series Outstanding performance at reasonable price
Outstanding performance
– Super high resolution CXP camera and precision 6㎛ lens
– Solder paste inspection up to 0201(㎜) size component pad
– High accuracy & repeatability
– Shadow-free dual projection 3D measurement
– Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel
Auto PCB warpage compensation
Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
Intellisys® : Total process management system for improving productivity and achieving smart factory
Standard 3D AOI for various manufacturing process
MIRTEC Foreign Object Detection
Additional information
| Inspection Type |
|---|
