Description

Mirtec MV-3L Desktop AOI System

Great inspection performance

– Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
– Angled camera system for solder inspection under J-lead, no-lead and coil component
– Lifted BGA package and CSP package inspection by laser unit

Multi-Vision® : simultaneous 5-dimension(Center, East, West, South, North) inspeciton by 18 mega pixel angled cameras

Intellisys® : Total process management system for improving productivity and achieving smart factory

Simple and easy auto programming using IPC international standard library

Off-line 2D AOI system meets outstanding performance, economy and space utilization