Soldering on Low Temperature Substrates in Milliseconds
A collaboration between NovaCentrix and the Holst Centre. PulseForge Soldering enables the soldering of standard lead-free solder pastes on low-cost, temperature sensitive substrates such as paper and PEN in milliseconds.
Available as both an Inline and standalone machine.
How It Works
|Solder paste is heated indirectly through a light-absorbing layer and components.|
|High contrast ratio absorption between layers allows for selective heating.|
|Pulses of high intensity light are used in place of a reflow oven to heat the solder to its liquidus temperature in milliseconds without damaging the underlying substrate.|
|High energy doses can be applied without damaging conductive tracks by protecting them with light-reflecting layers.|
How It Is Better
|Multiple types of components requiring different levels of heat can be soldered simultaneously.|
|Processing is much faster than reflow soldering and is roll-to-roll compatible.|
|Enables the use of standard lead-free solder pastes on temperature sensitive substrates – not possible with any other processing method.|