STA-10iL Automated Plasma Machine

    Description

    Gain flexibility and agility
    Our most versatile platform can be configured with drawer, conveyor, or rotary table. Whether you’re cleaning dies, silicon wafers, medical devices or molded plastic parts, the STA-10 can be easily configured for any job. Working volume is 350 x 475 x 100 mm.
    Eliminate excuses
    With a slim footprint, fast lead times, and flexible configurations there is no excuse to skip plasma surface preparation for critical processes. Save money and improve quality with turnkey systems configured for your application.
    DetailSpecification
    PurposeClean dies for packaging industry. Also used throughout semiconductor, electronics, Aero, Defense, laboratory, and university research.
    Speed mm/s1,000 mm/s
    Work area (X/Y/Z) mm
    550/760/60
    Footprint (W x D x H) mm
    1000 x 1500 x 1550
    Electrical supply
    200-240 VAC, 31 Amp, 50-60 Hz
    Compressed air
    0.4-0.6 MPa <280LPM clean dry air
    60-90 psi <10CFM
    Exhaust requirement
    >8.5m3/min
    >300 CFM
    Primary gasArgon or Helium
    Process gasesOxygen, Nitrogen, or Hydrogen (forming gas)
    Supported plasma headsLinear Beam: 25, 50, 100mm or Minibeam
    StandardsCE, SEMI S2 S8, MES, SECS/GEM
    Clean RoomClass 1,000 or 100 (ISO 6 or ISO 5)