STA-10iL Automated Plasma Machine
Gain flexibility and agility
Our most versatile platform can be configured with drawer, conveyor, or rotary table. Whether you’re cleaning dies, silicon wafers, medical devices or molded plastic parts, the STA-10 can be easily configured for any job. Working volume is 350 x 475 x 100 mm.
With a slim footprint, fast lead times, and flexible configurations there is no excuse to skip plasma surface preparation for critical processes. Save money and improve quality with turnkey systems configured for your application.
|Purpose||Clean dies for packaging industry. Also used throughout semiconductor, electronics, Aero, Defense, laboratory, and university research.|
|Speed mm/s||1,000 mm/s|
|Work area (X/Y/Z) mm||550/760/60|
|Footprint (W x D x H) mm||1000 x 1500 x 1550|
|Electrical supply||200-240 VAC, 31 Amp, 50-60 Hz|
|Compressed air||0.4-0.6 MPa <280LPM clean dry air|
60-90 psi <10CFM
|Primary gas||Argon or Helium|
|Process gases||Oxygen, Nitrogen, or Hydrogen (forming gas)|
|Supported plasma heads||Linear Beam: 25, 50, 100mm or Minibeam|
|Standards||CE, SEMI S2 S8, MES, SECS/GEM|
|Clean Room||Class 1,000 or 100 (ISO 6 or ISO 5)|