UNICOMP AX8500 X-Ray
Description
Application
SMT, BGA, CSP, Flip Chip, LED Detection,
Semiconductor, Packaging components, Battery Industry,
Electronic components, Automotive parts, Photo-voltaic,
Aluminium Die-casting, Moulding Plastic.
Ceramics, other special industries.
Features
• 110kV 5µm closed X-ray tube, high speed & Millions pixels high resolution FPD
• Tilt detection with ±45° operation together with 6-axis movement
• X-ray tube & detector automatic lifting and descending, with convenient target point positioning system
• Multi-function DXI image processing system, CNC programmable detection
• Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification