This paper roll is used to remove the solder paste residues or other viscous materials allocated into the stencil apertures or stencil contact side surface.
Based on the material complexion this stencil paper is capable to work with ultra-fine pitch apertures improving cleaning cycle time due high absorption. The stencil paper roll material contains a strong tensile strength, high absorbency with strong performance.

The interlaced non-woven fiber of our SMT stencil cleaning roll creates a better paper quality that makes the difference during the under-stencil cleaning process in comparison with the competitors.